JPH0749794Y2 - ワイヤレスボンデイング用金バンプ - Google Patents

ワイヤレスボンデイング用金バンプ

Info

Publication number
JPH0749794Y2
JPH0749794Y2 JP1989029563U JP2956389U JPH0749794Y2 JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2 JP 1989029563 U JP1989029563 U JP 1989029563U JP 2956389 U JP2956389 U JP 2956389U JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2
Authority
JP
Japan
Prior art keywords
bump
bumps
gold
ball
wireless bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989029563U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02120836U (en]
Inventor
正樹 森川
保 森
利昇 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP1989029563U priority Critical patent/JPH0749794Y2/ja
Publication of JPH02120836U publication Critical patent/JPH02120836U/ja
Application granted granted Critical
Publication of JPH0749794Y2 publication Critical patent/JPH0749794Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP1989029563U 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ Expired - Lifetime JPH0749794Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989029563U JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989029563U JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Publications (2)

Publication Number Publication Date
JPH02120836U JPH02120836U (en]) 1990-09-28
JPH0749794Y2 true JPH0749794Y2 (ja) 1995-11-13

Family

ID=31253886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989029563U Expired - Lifetime JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Country Status (1)

Country Link
JP (1) JPH0749794Y2 (en])

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4952973A (en]) * 1972-09-22 1974-05-23
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
JPS60134444A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd バンプ電極形成方法
JPS62152143A (ja) * 1985-12-26 1987-07-07 Toshiba Corp バンプ形成方法
JPS63173345A (ja) * 1987-01-12 1988-07-16 Nec Kansai Ltd バンプ電極形成方法
JPH0750726B2 (ja) * 1987-05-07 1995-05-31 松下電器産業株式会社 半導体チップの実装体

Also Published As

Publication number Publication date
JPH02120836U (en]) 1990-09-28

Similar Documents

Publication Publication Date Title
US5740956A (en) Bonding method for semiconductor chips
JPS6238414B2 (en])
JP3328135B2 (ja) バンプ形成用金合金線及びバンプ形成方法
US7475802B2 (en) Method for low loop wire bonding
JP3382918B2 (ja) 半導体素子接続用金線
JPH0749794Y2 (ja) ワイヤレスボンデイング用金バンプ
JPH0291944A (ja) 金バンプ用金合金細線
US6270000B1 (en) Wire bonding method
TWI358337B (en) Method and device of continuously wire-bonding bet
JP2773202B2 (ja) 半導体素子ボンディング用Ａｕ合金極細線
JP3586909B2 (ja) ボンディングワイヤ
JPH04255237A (ja) 半導体装置の製造方法
JP3202193B2 (ja) ワイヤボンディング方法
JPS60149154A (ja) 半導体装置の製造方法
JPH06112257A (ja) 半導体素子用Ｐｔ合金極細線
JPH0456326A (ja) 金バンプの形成方法
JP2728216B2 (ja) 半導体素子のボンディング用金線
JP2814756B2 (ja) 半導体装置
JPS5944836A (ja) ワイヤ−ボンデイング方法
JPH05251494A (ja) 半導体装置および半導体装置製造用キャピラリー
JPH07122562A (ja) バンプ形成方法及びワイヤボンディング方法並びにバンプ構造及びワイヤボンディング構造
JPH11340264A (ja) ワイヤバンプ形成用金合金線及びワイヤバンプ形成方法
JP2721259B2 (ja) ワイヤボンディング方法及びそれに使用する銅系リードフレーム
JPH0510362Y2 (en])
JP2002043491A (ja) 電子部品の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term